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    DATE
    2009
    IEEE
    154views Hardware» more  DATE 2009»
    Reliability aware through silicon via planning for 3D stacked ICs
    14 years 6 months ago
    Reliability aware through silicon via planning for 3D stacked ICs
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    Abstract—This work proposes reliability aware through silicon via (TSV) planning for the 3D stacked silicon integrated circuits (ICs). The 3D power distribution network is modele...
    Amirali Shayan Arani, Xiang Hu, He Peng, Chung-Kua...
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