DAC
2012
ACM
12 years 2 months ago
2012
ACM
Due to the large geometry of through-silicon-vias (TSVs) and their connections to the power grid, significant current crowding can occur in 3D ICs. Prior works model TSVs and pow...
DATE
2005
IEEE
14 years 6 months ago
2005
IEEE
— This paper suggests a methodology to decrease the power of a static CMOS standard cell design at layout level by focusing on switched capacitance. The term switched is the key:...