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ICCAD
2002
IEEE
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ICCAD 2002
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Shaping interconnect for uniform current density
14 years 8 months ago
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www.cs.york.ac.uk
As the VLSI technology scaling down, the electromigration problem becomes one of the major concerns in high-performance IC design for both power network and signal interconnects. ...
Muzhou Shao, D. F. Wong, Youxin Gao, Li-Pen Yuan, ...
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