FlexiVia ROM Compiler Programmable on Different Via Layers Based on Top Metal Assignment

We present a ROM compiler programmable from via 1 to via n – 2, where n is the number of metal layers. The layer on which the code via is landed can be selected by the user. With the coding being able to take place as close to the topmost metal as possible, the turnaround time for a revision is shortened. In this paper, we discuss the array assembly scheme and its impacts on the design considerations by the choice of strapping period.

• Type: Conference
• Year: 2006
• Where: MTDT
• Authors: Ding-Ming Kwai, Yung-Fa Chou, Meng-Fan Chang, Su-Meng Yang, Ding-Sheng Chen, Min-Chung Hsu, Yu-Zhen Liao, Shiao-Yi Lin, Yu-Ling Sung, Chia-Hsin Lee, Hsin-Kun Hsu
• Keywords: Array Assembly Scheme, Hardware, Metal Layers, MTDT 2006, ROM Compiler