Micromachined piezoresistive tactile sensor array fabricated by bulk-etched MUMPs process

The design, fabrication and testing of a 5 5 micromachined tactile sensor array for the detection of an extremely small force (micrometer-Newton range) has been discussed. An anisotropic etching of silicon substrate of a MUMPs process chip forms a central contacting pads that are trampoline-shape suspended structures and sensor beams. A piezoresistive layer of polysilicon embedded in sensor beams is used to detect the displacement of the suspended contacting pad. Each square tactile has dimension of 200 m 200 m with 250 m center-to-center spacing. The entire sensor area

• Type: Conference
• Year: 2003
• Where: ISCAS
• Authors: Tanom Lomas, A. Tuantranont, F. Cheevasuvit
• Keywords: ISCAS 2003, Sensor, Sensor Beams, Tactile Sensor Array