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ISLPED
2000
ACM

Model and analysis for combined package and on-chip power grid simulation

14 years 3 months ago
Model and analysis for combined package and on-chip power grid simulation
We present new modeling and simulation techniques to improve the accuracy and efficiency of transient analysis of large power distribution grids. These include an accurate model for the inherent decoupling capacitance of non-switching devices, as well as a statistical switching current model for the switching devices. Moreover, three new simulation techniques are presented for problem size-reduction and speed-up. Results of application of these techniques on three PowerPCtm microprocessors are also presented.
Rajendran Panda, David Blaauw, Rajat Chaudhry, Vla
Added 01 Aug 2010
Updated 01 Aug 2010
Type Conference
Year 2000
Where ISLPED
Authors Rajendran Panda, David Blaauw, Rajat Chaudhry, Vladimir Zolotov, Brian Young, Ravi Ramaraju
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