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ICRA
1994
IEEE

Accurate Alignment of Laminate Materials Using Sensor-Based Robot Techniques

14 years 3 months ago
Accurate Alignment of Laminate Materials Using Sensor-Based Robot Techniques
Assembly accuracies of 0.05-0.1 mm, needed for electronic product manufacture, are attainable with current automated manufacturing equipment. Aggressive electronic system designs will require manufacturing accuracies in the range of 0.005-0.01 mm. A system and strategy is described here tofabricate circuit boards requiring alignment accuracies of 7.5 pm using existing automation equipment with enhancements and typical manufacturing linefixtures. The system, configured as a pilot workcell, consisted of an IBM 7576 coarse positioning robot, a fine positioning manipulator, an optical sensing system and a unique bracing method to reduce environmental disturbances. The strategy was to use a coarse/flne placement technique with sensing to align, stack and bond individual test laminates with pattems of 100 p m holes. The results showed that pairs of holes were consistently aligned to 2-5 pm which surpasses the 7.5 pm manufacturing requirement.
Andrew E. Brennemann, Robert Hammer, Ralph L. Holl
Added 08 Aug 2010
Updated 08 Aug 2010
Type Conference
Year 1994
Where ICRA
Authors Andrew E. Brennemann, Robert Hammer, Ralph L. Hollis, William V. Jecusco II
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