Net and Pin Distribution for 3D Package Global Routing

In this paper, we study the net and pin distribution problem for global routing targeting three dimensional packaging layout via System-on-Package (SOP). The routing environment for the new emerging mixed-signal SOP technology is more advanced than that of the conventional PCB or MCM technology

• Type: Conference
• Year: 2004
• Where: DATE
• Authors: Jacob R. Minz, Mohit Pathak, Sung Kyu Lim
• Keywords: DATE 2004, Hardware, Mixed-signal Sop Technology, Pin Distribution, SOP Packaging Substrate