Prediction of radiated electromagnetic emissions from PCB traces based on green dyadics

Because it costs to solve ElectroMagnetic Compatibility (EMC) problems late in the development process, new methods have to predict radiated electromagnetic emissions at the design stage. In the case of complex Printed Circuit Boards (PCBs) containing embedded microstrips and a large number of nets, a tradeoff between accuracy and simulation time must be found for this evaluation. In this paper the basic algorithm used within a new emissions predictive analysis tool: ElectroMagnetic Interferences Radiated (EMIR) is presented. It is able to take accurately into account the actual crossection between the metal plane and the air for each PCB trace. It is compared to theoretical formulas for validation. The effects of superstrate (cover) on a dipole radiation are described.

• Type: Conference
• Year: 1995
• Where: EURODAC
• Authors: E. Leroux, Flavio G. Canavero, G. Vecchi
• Keywords: Complex Printed Circuit, Electromagnetic Compatibility, Electromagnetic Emissions, EURODAC 1995, VHDL