Surface Conditioning Effect on Vacuum Microelectronics Components Fabricated by Deep Reactive Ion Etching

Advances in material processing such as silicon micromachining are opening the way to vacuum microelectronics. Two-dimensional vacuum components can be fabricated using the microsystems processes. We developed such devices using a single metal layer and silicon micromachining by DRIE. The latter technological step has significant impact on the characteristics of the vacuum components. This paper presents a brief summary of electron emission possibilities and the design leading to the fabrication of a lateral field emission diode. First measurement results and the aging of the devices are also discussed.

• Type: Journal
• Year: 2007
• Where: CORR
• Authors: A. Phommahaxay, G. Lissorgues, L. Rousseau, T. Bourouina, P. Nicole
• Keywords: CORR 2007, Education, Electron Emission Possibilities, Two-dimensional Vacuum Components, Vacuum Components