Topological routing to maximize routability for package substrate

Compared with on-chip routers, the existing commercial tools for off-chip routing have a much lower routability and often result in a large number of unrouted nets for manual routing. In this paper, we develop an effective, yet efficient, substrate routing algorithm, applying dynamic pushing to alleviate the net ordering problem and reordering and rerouting for further wire length and congestion reduction. Compared with an industrial design tool that leaves 936 nets unrouted for nine industrial designs with a total of 6100 nets, our algorithm reduces the unrouted nets to 212, a 4.5-times net number reduction and practically more design time reduction. Categories and Subject Descriptors B.7.2 [Design Aids]: Placement and routing General Terms Algorithms, Experimentation Keywords IC package, substrate routing, system in package

• Type: Conference
• Year: 2008
• Where: DAC
• Authors: Shenghua Liu, Guoqiang Chen, Tom Tong Jing, Lei He, Tianpei Zhang, Robi Dutta, Xianlong Hong
• Keywords: DAC 2008, Design Automation, Manual Routing, Net Number Reduction, Substrate Routing Algorithm