Computationally Efficient Power Integrity Simulation for System-on-Package Applications

Power integrity simulation for system-on-package (SoP) based modules is a crucial bottleneck in the SoP design flow. In this paper, the multi-layer finite difference method (M-FDM) augmented with models for split planes has been proposed as a fast and accurate frequency domain engine. Results demonstrating the accuracy and scalability of the method have been presented. In particular, the algorithm was employed to the analysis of a realistic 6 layer package with 200k nodes. Categories and Subject Descriptors I.6 [Computing Methodologies]: Simulation and Modeling General Terms Algorithms, Design Keywords Signal/Power Integrity (SI/PI), System in Package (SiP), multi-layer finite difference method (M-FDM)

• Type: Conference
• Year: 2007
• Where: DAC
• Authors: Krishna Bharath, Ege Engin, Madhavan Swaminathan, Kazuhide Uriu, Toru Yamada
• Keywords: DAC 2007, Design Automation, Finite Difference Method, Multi-layer Finite Difference, SoP Design Flow