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    Modeling of board-level package by Finite Element Analysis and laser interferometer measurements

    13 years 10 months ago
    Modeling of board-level package by Finite Element Analysis and laser interferometer measurements
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    Bo Zhang, PinKuan Liu, Han Ding, Wenwu Cao
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    Added 29 Jan 2011
    Updated 29 Jan 2011
    Type Journal
    Year 2010
    Where MR
    Authors Bo Zhang, PinKuan Liu, Han Ding, Wenwu Cao
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