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44
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MR
2010
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MR 2010
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Applications of TEM imaging, analysis and electron holography to III-nitride HEMT devices
13 years 6 months ago
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David J. Smith, David A. Cullen, Lin Zhou, Martha ...
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2010
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Parameter selection for health monitoring of electronic products
13 years 10 months ago
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Sachin Kumar, Eli Dolev, Michael Pecht
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2010
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Modeling of board-level package by Finite Element Analysis and laser interferometer measurements
13 years 10 months ago
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Bo Zhang, PinKuan Liu, Han Ding, Wenwu Cao
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2010
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A prognostics and health management roadmap for information and electronics-rich systems
13 years 10 months ago
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Michael Pecht, Rubyca Jaai
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2010
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Design of differential low-noise amplifier with cross-coupled-SCR ESD protection scheme
13 years 10 months ago
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Chun-Yu Lin, Ming-Dou Ker, Yuan-Wen Hsiao
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2010
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Automated inspection and classification of flip-chip-contacts using scanning acoustic microscopy
13 years 10 months ago
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Industrial applications often require failure analysis methods working non-destructively, enabling either a rapid quality control or fault isolation and defect localization prior ...
S. Brand, P. Czurratis, P. Hoffrogge, M. Petzold
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