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ICCAD
2010
IEEE

3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling

13 years 9 months ago
3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling
Categories and Subject Descriptors Keywords .
Arvind Sridhar, Alessandro Vincenzi, Martino Ruggi
Added 11 Feb 2011
Updated 11 Feb 2011
Type Journal
Year 2010
Where ICCAD
Authors Arvind Sridhar, Alessandro Vincenzi, Martino Ruggiero, Thomas Brunschwiler, David Atienza
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