This paper discusses several forms of heterogeneity in systems on chip and systems in package. A means to distinguish the various forms of heterogeneity is given, with an estimation of the maturity of design and modeling techniques with respect to various physical domains. Industry-level MEMS integration, and more prospective microfluidic biochip systems are considered at both technological and EDA levels. Finally, specific flows for bstraction heterogeneity in RF SiP and for functional co-verification are discussed.
I. O'Connor, B. Courtois, K. Chakrabarty, N. Delor