Automation of assembly and packaging at the micro/nano-scale

— This paper provides a general overview of the material covered in the fullday workshop with the same title devoted to the field of automation in microassembly and packaging at the micro/nanoscale. act and objectives The objective of this workshop is to give an overview of current automation techniques and control for systems used to perform precise assembly and packaging at the micro/nano-world. The specificities of micro/nano-world (adhesion forces, difficulty to embed high performances measurement systems and to use direct sensing, high sensitivity to environmental disturbances) lead to the development of new approaches and methodologies for control and tracking tasks. Furthermore, the severe performances (submicrometric resolution, high bandwidth) required to success the micro/nano-assembly and packaging involve the use of robust and efficient control techniques and methodologies. The speakers will present the recent development on the automation of assembly and packaging at m...

• Type: Journal
• Year: 2011
• Where: CASE
• Authors: Micky Rakotondrabe, Yassine Haddab, Cédric Clévy, Philippe Lutz
• Keywords: CASE 2011, Mechatronic Systems, Micro Nano, Nano World