Broadband Impedance Matching for Inductive Interconnect in VLSI Packages

Abstract— Noise induced by impedance discontinuities from VLSI packaging is one of the leading challenges facing system level designers in the next decade. The performance of IC cores far exceeds that of current packaging technology. The risetimes of IC signals require that the interconnect of the package be treated as transmission lines. As a result, impedance discontinuities in the package cause reflections which may result in intermittent switching of digital signals and edge time degradation, both of which limit system performance. The major cause of the impedance discontinuity in the package is the high inductance of the wire bond interconnect. To compensate for this problem, capacitance can be placed near the wire bond to reduce its effective impedance over a given frequency range. This paper presents the application of this impedance matching technique for use in broadband digital signals that are prevalent in modern VLSI designs. Both static and dynamic compensation approach...

• Type: Conference
• Year: 2005
• Where: ICCD
• Authors: Brock J. LaMeres, Sunil P. Khatri
• Keywords: Hardware, ICCD 2005, Wire Bond, Wire Bond Inductance, Wire Bond Interconnect