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    ICCD
    2005
    IEEE
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    Broadband Impedance Matching for Inductive Interconnect in VLSI Packages
    14 years 8 months ago
    Broadband Impedance Matching for Inductive Interconnect in VLSI Packages
    Download  www.coe.montana.edu
    Abstract— Noise induced by impedance discontinuities from VLSI packaging is one of the leading challenges facing system level designers in the next decade. The performance of IC ...
    Brock J. LaMeres, Sunil P. Khatri
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