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2007

Cohesive zone modeling for structural integrity analysis of IC interconnects

13 years 12 months ago
Cohesive zone modeling for structural integrity analysis of IC interconnects
Due to the miniaturization of integrated circuits, their thermo-mechanical reliability tends to become a truly critical design criterion.
B. A. E. van Hal, R. H. J. Peerlings, M. G. D. Gee
Added 27 Dec 2010
Updated 27 Dec 2010
Type Journal
Year 2007
Where MR
Authors B. A. E. van Hal, R. H. J. Peerlings, M. G. D. Geers, Olaf van der Sluis
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