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    Cohesive zone modeling for structural integrity analysis of IC interconnects
    13 years 11 months ago
    Cohesive zone modeling for structural integrity analysis of IC interconnects
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    Due to the miniaturization of integrated circuits, their thermo-mechanical reliability tends to become a truly critical design criterion.
    B. A. E. van Hal, R. H. J. Peerlings, M. G. D. Gee...
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