Electromigration-Aware Physical Design of Integrated Circuits

The electromigration effect within current-density-stressed signal and power lines is an ubiquitous and increasingly important reliability and design problem in sub-micron IC designs. It is therefore necessary to consider electromigration-related design parameters as early as possible in the physical design flow. In this

• Type: Conference
• Year: 2005
• Where: VLSID
• Authors: Göran Jerke, Jens Lienig
• Keywords: Computer Architecture, Electromigration-related Design Parameters, Physical Design Flow, Sub-micron Ic Designs, VLSID 2005