The electromigration effect within current-density-stressed signal and power lines is an ubiquitous and increasingly important reliability and design problem in sub-micron IC desi...
In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...
Mohit Pathak, Young-Joon Lee, Thomas Moon, Sung Ky...
3-D monolithic integration (3DMI), also termed as sequential integration, is a potential technology for future gigascale circuits. Since the device layers are processed in sequent...
This paper presents a layout generation tool that aims to reduce the gap between electrical sizing and physical realization of high performance analog circuits. The procedural lay...
Physical synthesis is a relatively young field in Electronic Design Automation. Many published optimizations for physical synthesis end up hurting the quality of the final design,...