High-performance, cost-effective heterogeneous 3D FPGA architectures

In this paper, we propose novel architectural and design techniques for three-dimensional field-programmable gate arrays (3D FPGAs) with Through-Silicon Vias (TSVs). We develop a novel design partitioning methodology that maps the heterogeneous computational resources of an FPGA into a number of die such that the total die area is minimized and the FPGA performance is maximized. Minimizing the total die area leads to direct manufacturing cost savings which is an important incentive to bring 3D technology to the fab and onto the market. An estimation framework is developed to assess the impact of silicon area utilized by 3D interconnect resources while taking into account the large area occupied by TSVs which is crucial to total die area of 3D FPGAs. In order to improve area and performance of 3D FPGAs, we design a novel 3D switch box with bypass TSVs. We also analyze the impact of different partitioning strategies on die area and find the optimal number of die that gives the largest...

• Type: Conference
• Year: 2009
• Where: GLVLSI
• Authors: Roto Le, Sherief Reda, R. Iris Bahar
• Keywords: Design Partitioning Methodology, GLVLSI 2009, Total Die Area, VLSI, field-programmable Gate Arrays