Increasing values and spread in leakage current makes it impossible to distinguish between faulty and fault-free chips using single threshold method. Neighboring chips on a wafer have similar fault-free properties. By obtaining differences in IDDQ values it is possible to discriminate faulty dice. In this paper, a technique in which comparison of IDDQ of a die with that of its neighboring dice on the wafer is evaluated. The analysis based on the SEMATECH test data? is presented.
Sagar S. Sabade, D. M. H. Walker