Impact of Modern Process Technologies on the Electrical Parameters of Interconnects

Abstract-- This paper presents the results obtained from an experimental study of the impact of modern process technologies on the electrical parameters of interconnects. Variations in parasitic capacitances and resistances due to dummy metal fills, chemical mechanical polishing, multiple thin inter-layer dielectrics and trapezoidal conductor crosssections are presented. Accurate variations in the parasitics are reported for a set of timing critical nets using 3d field solvers for extraction. Results obtained on a set of industrial designs show that the impact of dummy fills and trapezoidal conductor cross-sections are significant.

• Type: Conference
• Year: 2007
• Where: VLSID
• Authors: Debjit Sinha, Jianfeng Luo, Subramanian Rajagopalan, Shabbir H. Batterywala, Narendra V. Shenoy, Hai Zhou
• Keywords: Computer Architecture, Dummy Fills, Trapezoidal Conductor Cross-sections, Trapezoidal Conductor Crosssections, VLSID 2007