Manufacturing-Aware Physical Design

Ultra-deep submicron manufacturability impacts physical design (PD) through complex layout rules and large guardbands for process variability; this creates new requirements for new manufacturing-aware PD technologies. The first part of this tutorial reviews PD complications and methodology changes - notably in the detailed routing arena - that arise from subwavelength lithography and deep-submicron manufacturing (antennas, metal planarization and maskwafer mismatch). Process variations and their sources are taxonomized for modeling and simulation. A framework of design for cost and value is described. The second part covers yield-constrained optimizations in PD, especially “beyond corners” approaches that escape today’s pessimistic or even incorrect corner-based approaches. Statistical timing and noise analyses enable optimization of parametric yield and reliability. Yield-aware cell libraries and “analog” design rules (as opposed to “digital”, 0/1 rules) can help desig...

• Type: Conference
• Year: 2003
• Where: ICCAD
• Authors: Puneet Gupta, Andrew B. Kahng
• Keywords: Design-to-manufacturing Pd Methodology, Hardware, ICCAD 2003, Manufacturing-aware Pd Technologies, Reviews Pd Complications