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21

ISLPED
2003
ACM

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Microarchitecture level power and thermal simulation considering temperature dependent leakage model

14 years 4 months ago

Microarchitecture level power and thermal simulation considering temperature dependent leakage model

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Weiping Liao, Fei Li, Lei He

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ISLPED 2003 |

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Added	05 Jul 2010
Updated	05 Jul 2010
Type	Conference
Year	2003
Where	ISLPED
Authors	Weiping Liao, Fei Li, Lei He

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