12 search results - page 1 / 3 » Microarchitecture level power and thermal simulation conside... |
ISLPED
2003
ACM
2003
ACM
Microarchitecture level power and thermal simulation considering temperature dependent leakage model
14 years 5 days ago
TCAD
2008
13 years 6 months ago
2008
The nonuniform substrate thermal profile and process variations are two major concerns in the present-day ultradeep submicrometer designs. To correctly predict performance/ leakage...
ISQED
2010
IEEE
14 years 1 months ago
2010
IEEE
Abstract— As the semiconductor technology continues its marching toward the deep sub-micron domain, the strong relation between leakage current and temperature becomes critical i...
DATE
2007
IEEE
14 years 1 months ago
2007
IEEE
Lateral heat conduction between modules affects the temperature profile of a floorplan, affecting the leakage power of individual blocks which increasingly is becoming a larger ...
ICCAD
2006
IEEE
14 years 3 months ago
2006
IEEE
As CMOS technology scales into the nanometer regime, power dissipation and associated thermal concerns in high-performance ICs due to on-chip hot-spots and thermal gradients are b...