ISLPED
2006
ACM
14 years 6 months ago
2006
ACM
All existing methods for thermal-via allocation are based on a steady-state thermal analysis and may lead to excessive number of thermal vias. This paper develops an accurate and ...
ASPDAC
2006
ACM
14 years 6 months ago
2006
ACM
Three-dimensional integrated circuits (3D ICs) provide an attractive solution for improving circuit performance. Such solutions must be embedded in an electrothermally-conscious d...
DATE
2006
IEEE
14 years 6 months ago
2006
IEEE
Abstract— 3D circuits have the potential to improve performance over traditional 2D circuits by reducing wirelength and interconnect delay. One major problem with 3D circuits is ...
ICCD
2007
IEEE
14 years 9 months ago
2007
IEEE
One of the biggest challenges in 3D stacked IC design is heat dissipation. Incorporating thermal vias is a promising method for reducing the temperatures of 3D ICs. The bonding st...