Wafer-scale 3D integration of InGaAs image sensors with Si readout circuits

14 years 7 months ago

Chang-Lee Chen, D.-R. Yost, Jeffrey M. Knecht, Dav

3DIC 2009 | Hardware |

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Added	18 May 2010
Updated	18 May 2010
Type	Conference
Year	2009
Where	3DIC
Authors	Chang-Lee Chen, D.-R. Yost, Jeffrey M. Knecht, David C. Chapman, Douglas C. Oakley, Leonard J. Mahoney, Joseph P. Donnelly, Antonio M. Soares, Vyshnavi Suntharalingam, Robert Berger, V. Bolkhovsky, W. Hu, Bruce D. Wheeler, Craig L. Keast, David C. Shaver

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