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This paper presents an analysis and comparison between synchronous and delay-insensitive asynchronous logic circuits on thermal distributions for investigating novel solutions to t...
Brent Hollosi, Tao Zhang, Ravi Sankar Parameswaran...
Abstract— Networks-on-chip (NoC) is emerging as a key onchip communication architecture for multiprocessor systemson-chip (MPSoC). In traditional electronic NoCs, high bandwidth ...
Yaoyao Ye, Lian Duan, Jiang Xu, Jin Ouyang, Mo Kwa...
This paper investigates the effect of the TSV resistance (RTSV) on the performance of boost converters for Solid State Drive (SSD) using circuit simulation. When RTSV is 0Ω, both ...
- In this paper, an electrical-thermal co-analysis method for power delivery networks in 3D system integration is proposed. For electrical analysis, temperature-dependent electrica...
Several forms of processor memory organizations have been in use to optimally access off-chip memory systems mainly the Hard disk drives (HDD). Recent trends show that the solid s...
Abstract—In 3DICs heat dissipating devices are stacked directly on top of each other leading to a higher heat density than in a comparable 2D chip. 3D integration also moves the ...
Samson Melamed, Thorlindur Thorolfsson, Adi Sriniv...
—A high-sensitivity capacitive-coupling interface is presented for wireless wafer testing systems. The transmitter is a buffer that drives the transmitter pad, and the receiver c...
Abstract—Modeling parasitic parameters of Through-SiliconVia (TSV) structures is essential in exploring electrical characteristics such as delay and signal integrity (SI) of circ...
Roshan Weerasekera, Matt Grange, Dinesh Pamunuwa, ...
The first memristor, originally theorized by Dr. Leon Chua in 1971, was identified by a team at HP Labs in 2008. This new fundamental circuit element is unique in that its resis...