10 search results - page 2 / 2 » 3D Stacked Microprocessor: Are We There Yet |
ISCA
2008
IEEE
14 years 1 months ago
2008
IEEE
Three-dimensional integration enables stacking memory directly on top of a microprocessor, thereby significantly reducing wire delay between the two. Previous studies have examin...
RECOMB
2008
Springer
14 years 7 months ago
2008
Springer
The development of high-resolution microscopy makes possible the high-throughput screening of cellular information, such as gene expression at single cell resolution. One of the cr...
ISCA
2007
IEEE
14 years 1 months ago
2007
IEEE
Much like multi-storey buildings in densely packed metropolises, three-dimensional (3D) chip structures are envisioned as a viable solution to skyrocketing transistor densities an...
CVPR
2010
IEEE
14 years 3 months ago
2010
IEEE
Acquiring and representing the 4D space of rays in the world (the light field) is important for many computer vision and graphics applications. Yet, light field acquisition is c...
DATE
2009
IEEE
14 years 2 months ago
2009
IEEE
—Caches made of non-volatile memory technologies, such as Magnetic RAM (MRAM) and Phase-change RAM (PRAM), offer dramatically different power-performance characteristics when com...