9152 search results - page 156 / 1831 » 3D or not 3D |
ECCV
2010
Springer
14 years 2 months ago
2010
Springer
Abstract. In this paper we propose a probabilistic framework that models shape variations and infers dense and detailed 3D shapes from a single silhouette. We model two types of sh...
ASPDAC
2012
ACM
12 years 5 months ago
2012
ACM
—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
IVC
2010
13 years 8 months ago
2010
We propose an algorithm for automatically obtaining a segmentation of a rigid object in a sequence of images that are calibrated for camera pose and intrinsic parameters. Until re...
ECCV
2006
Springer
14 years 11 months ago
2006
Springer
Abstract. Foreground and background segmentation is a typical problem in computer vision and medical imaging. In this paper, we propose a new learning based approach for 3D segment...
ISPD
2010
ACM
14 years 4 months ago
2010
ACM
Existing 3D placement techniques are mainly used for standardcell circuits, while mixed-size placement is needed to support highlevel functional units and intellectual property (I...