1419 search results - page 127 / 284 » A Characterization of Constructive Dimension |
134
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ICCAD
2005
IEEE
16 years 1 months ago
2005
IEEE
— Variability in the chip design process has been relatively increasing with technology scaling to smaller dimensions. Using worst case analysis for circuit optimization severely...
148
Voted
SEMCO
2009
IEEE
15 years 11 months ago
2009
IEEE
—Techniques for automatic annotation of spoken content making use of speech recognition technology have long been characterized as holding unrealized promise to provide access to...
130
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ASPDAC
2009
ACM
15 years 11 months ago
2009
ACM
Abstract— Double patterning lithography (DPL) is in current production for memory products, and is widely viewed as inevitable for logic products at the 32nm node. DPL decomposes...
124
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FOSSACS
2010
Springer
15 years 11 months ago
2010
Springer
Abstract. Spatial logics have been introduced to reason about distributed computation in models for concurrency. We first define a spatial logic for a general class of infinite-...
158
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ICDCSW
2008
IEEE
15 years 11 months ago
2008
IEEE
Emergence of successful teleoperation applications requires the convergence of diverse domains like robotics, machine learning, sensing, actuation, control and communication. We e...