94 search results - page 4 / 19 » A Fast and Energy-Efficient Stack |
ICCAD
2009
IEEE
13 years 5 months ago
2009
IEEE
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
GLVLSI
2003
IEEE
14 years 27 days ago
2003
IEEE
With scaling down to deep submicron and nanometer technologies, noise immunity is becoming a metric of the same importance as power, speed, and area. Smaller feature sizes, low vo...
FAST
2008
13 years 10 months ago
2008
An important threat to reliable storage of data is silent data corruption. In order to develop suitable protection mechanisms against data corruption, it is essential to understan...
ICASSP
2011
IEEE
12 years 11 months ago
2011
IEEE
A common problem in speech recognition for foreign accented speech is that there is not enough training data for an accent-specific or a speaker-specific recognizer. Speaker ada...
SP
1998
IEEE
13 years 12 months ago
1998
IEEE
When computationally intensive tasks have to be carried out on trusted, but limited, platforms such as smart cards, it becomes necessary to compensate for the limited resources me...