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ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
14 years 4 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
GECCO
2007
Springer
164views Optimization» more  GECCO 2007»
14 years 1 months ago
Is the island model fault tolerant?
In this paper, we present a study on the fault tolerance nature of the island model when applied to Genetic Algorithms. Parallel and distributed models have been extensively appli...
José Ignacio Hidalgo, Juan Lanchares, Franc...
GECCO
2007
Springer
135views Optimization» more  GECCO 2007»
14 years 1 months ago
A cumulative evidential stopping criterion for multiobjective optimization evolutionary algorithms
In this work we present a novel and efficient algorithm– independent stopping criterion, called the MGBM criterion, suitable for Multiobjective Optimization Evolutionary Algorit...
Luis Martí, Jesús García, Ant...
GECCO
2008
Springer
186views Optimization» more  GECCO 2008»
13 years 8 months ago
A pareto following variation operator for fast-converging multiobjective evolutionary algorithms
One of the major difficulties when applying Multiobjective Evolutionary Algorithms (MOEA) to real world problems is the large number of objective function evaluations. Approximate...
A. K. M. Khaled Ahsan Talukder, Michael Kirley, Ra...
INFOCOM
2002
IEEE
14 years 20 days ago
Optimal Configuration of OSPF Aggregates
—Open Shortest Path First (OSPF) is a popular protocol for routing within an autonomous system (AS) domain. In order to scale for large networks containing hundreds and thousands...
Rajeev Rastogi, Yuri Breitbart, Minos N. Garofalak...