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» A Heuristic for Channel Routing
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ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
14 years 4 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
ICC
2007
IEEE
130views Communications» more  ICC 2007»
14 years 2 months ago
A Distributed Scheme for Responsive Network Engineering
— Optimal bandwidth utilisation together with resilience and recovery from failure are two key drivers for Traffic Engineering (TE) which have been widely addressed by the IP co...
Johannes Göbel, Anthony E. Krzesinski, Dieter...
INFOCOM
2005
IEEE
14 years 1 months ago
Topology aware overlay networks
— Recently, overlay networks have emerged as a means to enhance end-to-end application performance and availability. Overlay networks attempt to leverage the inherent redundancy ...
Junghee Han, David Watson, Farnam Jahanian
INFOCOM
2002
IEEE
14 years 25 days ago
Optimal Configuration of OSPF Aggregates
—Open Shortest Path First (OSPF) is a popular protocol for routing within an autonomous system (AS) domain. In order to scale for large networks containing hundreds and thousands...
Rajeev Rastogi, Yuri Breitbart, Minos N. Garofalak...
INFOCOM
2011
IEEE
12 years 11 months ago
Timely data delivery in a realistic bus network
Abstract—WiFi-enabled buses and stops may form the backbone of a metropolitan delay tolerant network, that exploits nearby communications, temporary storage at stops, and predict...
Utku Acer, Paolo Giaccone, David Hay, Giovanni Neg...