Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
— Optimal bandwidth utilisation together with resilience and recovery from failure are two key drivers for Traffic Engineering (TE) which have been widely addressed by the IP co...
— Recently, overlay networks have emerged as a means to enhance end-to-end application performance and availability. Overlay networks attempt to leverage the inherent redundancy ...
—Open Shortest Path First (OSPF) is a popular protocol for routing within an autonomous system (AS) domain. In order to scale for large networks containing hundreds and thousands...
Rajeev Rastogi, Yuri Breitbart, Minos N. Garofalak...
Abstract—WiFi-enabled buses and stops may form the backbone of a metropolitan delay tolerant network, that exploits nearby communications, temporary storage at stops, and predict...
Utku Acer, Paolo Giaccone, David Hay, Giovanni Neg...