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ICCAD
2008
IEEE
161views Hardware» more  ICCAD 2008»
14 years 4 months ago
A low-overhead fault tolerance scheme for TSV-based 3D network on chip links
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...
IT
2008
159views more  IT 2008»
13 years 7 months ago
Service Oriented Architecture - Overview of Technologies and Standards
provides a powerful abstraction basically allowing to perceiving all compute resources as entities that can be dynamically discovered and composed. These entities are called servic...
Dimka Karastoyanova, Frank Leymann
SAC
2006
ACM
14 years 1 months ago
Post-partition reconciliation protocols for maintaining consistency
This paper addresses design exploration for protocols that are employed in systems with availability-consistency tradeoffs. Distributed data is modelled as states of objects repl...
Mikael Asplund, Simin Nadjm-Tehrani
MATA
2004
Springer
103views Communications» more  MATA 2004»
14 years 1 months ago
Mobility Prediction for Mobile Agent-Based Service Continuity in the Wireless Internet
New challenging deployment scenarios are integrating mobile devices with limited and heterogeneous capabilities that roam among wireless access localities during service provisioni...
Paolo Bellavista, Antonio Corradi, Carlo Giannelli
GLOBECOM
2007
IEEE
14 years 2 months ago
Discovering Topologies at Router Level: Part II
—Measurement and monitoring of network topologies are essential tasks in current network scenarios. Indeed, due to their utility in planning, management, security, and reliabilit...
Alessio Botta, Walter de Donato, Antonio Pescap&eg...