— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...
provides a powerful abstraction basically allowing to perceiving all compute resources as entities that can be dynamically discovered and composed. These entities are called servic...
This paper addresses design exploration for protocols that are employed in systems with availability-consistency tradeoffs. Distributed data is modelled as states of objects repl...
New challenging deployment scenarios are integrating mobile devices with limited and heterogeneous capabilities that roam among wireless access localities during service provisioni...
Paolo Bellavista, Antonio Corradi, Carlo Giannelli
—Measurement and monitoring of network topologies are essential tasks in current network scenarios. Indeed, due to their utility in planning, management, security, and reliabilit...
Alessio Botta, Walter de Donato, Antonio Pescap&eg...