Soft errors in logic are emerging as a significant reliability problem for VLSI designs. This paper presents novel circuit optimization techniques to mitigate soft error rates (SE...
—Increasing power density causes die overheating due to limited cooling capacity of the package. Conventional thermal management techniques e.g. logic shutdown, clock gating, fre...
Reliability modeling and evaluation is expected to be one of the major issues in emerging nano-devices and beyond 22nm CMOS. Such devices would have inherent propensity for gate f...
Teaching the practical aspects of device and chip design in New Zealand presents many problems, including high manufacturing costs, long lead times, and the lack of local industry...
Richard J. Blaikie, Maan M. Alkaisi, Steven M. Dur...
As technology continues to scale beyond 100nm, there is a significant increase in performance uncertainty of CMOS logic due to process and environmental variations. Traditional c...
Dinesh Patil, Sunghee Yun, Seung-Jean Kim, Alvin C...