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ASPDAC
2007
ACM
164views Hardware» more  ASPDAC 2007»
13 years 11 months ago
Thermal-Aware 3D IC Placement Via Transformation
- 3D IC technologies can help to improve circuit performance and lower power consumption by reducing wirelength. Also, 3D IC technology can be used to realize heterogeneous system-...
Jason Cong, Guojie Luo, Jie Wei, Yan Zhang
TSMC
2008
104views more  TSMC 2008»
13 years 7 months ago
Head Yaw Estimation From Asymmetry of Facial Appearance
This paper proposes a novel method to estimate the head yaw rotations based on the asymmetry of 2-D facial appearance. In traditional appearance-based pose estimation methods, feat...
Bingpeng Ma, Shiguang Shan, Xilin Chen, Wen Gao
SOQUA
2007
13 years 8 months ago
Designing multi-layers self-adaptive complex applications
The impossibility of statically determining the behavior of complex systems that interact at runtime with heterogeneous devices and remote entities, may lead to unexpected system ...
Davide Lorenzoli, Davide Tosi, Salvatore Venticinq...
SLIP
2004
ACM
14 years 28 days ago
Optical solutions for system-level interconnect
Throughput, power consumption, signal integrity, pin count and routing complexity are all increasingly important interconnect issues that the system designer must deal with. Recen...
Ian O'Connor
MOBIWAC
2009
ACM
14 years 2 months ago
Protocol design and analysis of a HIP-based per-application mobility management platform
Rapid evolution of wireless networking has provided wide-scale of different wireless access technologies like Bluetooth, ZigBee, 802.11a/b/g, DSRC, 3G UMTS, LTE, WiMAX, etc. The c...
László Bokor, László T...