Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
: The past decade witnessed rapid development of constraint satisfaction technologies, where algorithms are now able to cope with larger and harder problems. However, owing to the ...
Abdulwahed M. Abbas, Edward P. K. Tsang, Ahmad H. ...
This paper describes a new algorithm for solving the N-camera stereo correspondence problem by transforming it into a maximum- ow problem. Once solved, the minimum-cut associated ...
Abstract. We give a novel general approach for solving NP-hard optimization problems that combines dynamic programming and fast matrix multiplication. The technique is based on red...
We address ranging energy optimization for an unsynchronized localization system, which features robust sensor positioning, in the sense that specific accuracy requirements are f...
Tao Wang, Geert Leus, Dries Neirynck, Feng Shu, Li...