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ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
14 years 4 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
AICCSA
2006
IEEE
95views Hardware» more  AICCSA 2006»
14 years 1 months ago
DEPICT: A High-Level Formal Language For Modeling Constraint Satisfaction Problems
: The past decade witnessed rapid development of constraint satisfaction technologies, where algorithms are now able to cope with larger and harder problems. However, owing to the ...
Abdulwahed M. Abbas, Edward P. K. Tsang, Ahmad H. ...
ICCV
1998
IEEE
14 years 3 days ago
A Maximum-Flow Formulation of the N-Camera Stereo Correspondence Problem
This paper describes a new algorithm for solving the N-camera stereo correspondence problem by transforming it into a maximum- ow problem. Once solved, the minimum-cut associated ...
Sébastien Roy, Ingemar J. Cox
ESA
2006
Springer
105views Algorithms» more  ESA 2006»
13 years 11 months ago
Dynamic Programming and Fast Matrix Multiplication
Abstract. We give a novel general approach for solving NP-hard optimization problems that combines dynamic programming and fast matrix multiplication. The technique is based on red...
Frederic Dorn
ICASSP
2009
IEEE
14 years 2 months ago
Ranging energy optimization for robust sensor positioning
We address ranging energy optimization for an unsynchronized localization system, which features robust sensor positioning, in the sense that specific accuracy requirements are f...
Tao Wang, Geert Leus, Dries Neirynck, Feng Shu, Li...