1325 search results - page 224 / 265 » A Scaling Result for Explosive Processes |
132
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MICRO
2006
IEEE
15 years 10 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
139
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MICRO
2006
IEEE
15 years 10 months ago
2006
IEEE
One of the major issues faced by the semiconductor industry today is that of reducing chip yields. As the process technologies have scaled to smaller feature sizes, chip yields ha...
146
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MIDDLEWARE
2004
Springer
15 years 10 months ago
2004
Springer
The Internet provides a wealth of useful information in a vast number of dynamic information sources, but it is difficult to determine which sources are useful for a given query. ...
141
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CIVR
2008
Springer
15 years 6 months ago
2008
Springer
We describe a novel approach to identifying specific settings in large collections of passively captured images corresponding to a visual diary. An algorithm developed for setting...
157
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BMCBI
2007
15 years 4 months ago
2007
Background: Predicting protein complexes from experimental data remains a challenge due to limited resolution and stochastic errors of high-throughput methods. Current algorithms ...