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135
Voted
CODES
2007
IEEE
15 years 8 months ago
2007
IEEE
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
115
Voted
ISSAC
2007
Springer
15 years 8 months ago
2007
Springer
We discuss the parallelization of algorithms for solving polynomial systems symbolically by way of triangular decompositions. We introduce a component-level parallelism for which ...
102
Voted
LCTRTS
2005
Springer
15 years 8 months ago
2005
Springer
Real-time garbage collection has been shown to be feasible, but for programs with high allocation rates, the utilization achievable is not sufficient for some systems. Since a hi...
147
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MOBICOM
2004
ACM
15 years 7 months ago
2004
ACM
Recent years have seen the growing popularity of multi-rate wireless network devices (e.g., 802.11a cards) that can exploit variations in channel conditions and improve overall ne...
ICPP
1998
IEEE
15 years 6 months ago
1998
IEEE
We propose a new universal High-Level Information (HLI) format to effectively integrate front-end and back-end compilers by passing front-end information to the back-end compiler....