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» A Study of Collaboration in Software Design
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DAC
2011
ACM
12 years 7 months ago
Thermal-aware cell and through-silicon-via co-placement for 3D ICs
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
Jason Cong, Guojie Luo, Yiyu Shi
CHI
2009
ACM
14 years 8 months ago
Making sense of strangers' expertise from signals in digital artifacts
Contemporary work increasingly involves interacting with strangers in technology-mediated environments. In this context, we come to rely on digital artifacts to infer characterist...
N. Sadat Shami, Kate Ehrlich, Geri Gay, Jeffrey T....
AGILEDC
2009
IEEE
14 years 2 months ago
Fully Distributed Scrum: Linear Scalability of Production between San Francisco and India
—The Scrum software development framework was designed for the hyperproductive state where productivity increases by 5-10 times over waterfall teams and many colocated teams have...
Jeff Sutherland, Guido Schoonheim, N. Kumar, V. Pa...
KBSE
2005
IEEE
14 years 1 months ago
Automated replay and failure detection for web applications
User-session-based testing of web applications gathers user sessions to create and continually update test suites based on real user input in the field. To support this approach ...
Sara Sprenkle, Emily Gibson, Sreedevi Sampath, Lor...
IPPS
2003
IEEE
14 years 1 months ago
Multi-Paradigm Framework for Parallel Image Processing
A software framework for the parallel execution of sequential programs using C++ classes is presented. The functional language Concurrent ML is used to implement the underlying ha...
David J. Johnston, Martin Fleury, Andy C. Downton