1890 search results - page 362 / 378 » A case for network musical performance |
ICCAD
2009
IEEE
13 years 5 months ago
2009
IEEE
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
DAC
2011
ACM
12 years 7 months ago
2011
ACM
As transistor dimensions continue to scale deep into the nanometer regime, silicon reliability is becoming a chief concern. At the same time, transistor counts are scaling up, ena...
ICIP
2002
IEEE
14 years 9 months ago
2002
IEEE
This paper is organized as follows. In Section 2, we formulate the proposed UMPC method for modeling nonstationary and multi-modal data. Both MPC and UPC are shown to be special ca...
SIGMOD
2009
ACM
14 years 8 months ago
2009
ACM
With large amounts of correlated probabilistic data being generated in a wide range of application domains including sensor networks, information extraction, event detection etc.,...
ICPADS
2007
IEEE
14 years 2 months ago
2007
IEEE
This paper proposes a new priority scheduling algorithm to maximise site revenue of session-based multi-tier Internet services in a multicluster environment. This research is part...