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» A comparative analysis of groupware application protocols
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TPDS
1998
129views more  TPDS 1998»
13 years 7 months ago
The Offset Cube: A Three-Dimensional Multicomputer Network Topology Using Through-Wafer Optics
—Three-dimensional packaging technologies are critical for enabling ultra-compact, massively parallel processors (MPPs) for embedded applications. Through-wafer optical interconn...
W. Stephen Lacy, José Cruz-Rivera, D. Scott...
WCNC
2008
IEEE
14 years 1 months ago
On the Distribution of Positioning Errors in Wireless Sensor Networks: A Simulative Comparison of Optimization Algorithms
Abstract—Recent advances in the technology of wireless electronic devices have made possible to build ad–hoc Wireless Sensor Networks (WSNs) using inexpensive nodes consisting ...
Stefano Tennina, Marco Di Renzo, Fortunato Santucc...
PEWASUN
2007
ACM
13 years 8 months ago
Worst-case lifetime computation of a wireless sensor network by model-checking
Wireless Sensor Network (WSN) technology is now mature enough to be used in numerous application domains. However, due to the restricted amount of energy usually allocated to each...
Laurent Mounier, Ludovic Samper, Wassim Znaidi
VLSID
2001
IEEE
200views VLSI» more  VLSID 2001»
14 years 7 months ago
Evaluation of the Traffic-Performance Characteristics of System-on-Chip Communication Architectures
The emergence of several communication architectures for System-on-Chips provides designers with a variety of design alternatives. In addition, the need to customize the system ar...
Kanishka Lahiri, Sujit Dey, Anand Raghunathan
JPDC
2007
209views more  JPDC 2007»
13 years 7 months ago
Application-aware integration of data collection and power management in wireless sensor networks
Sensors are typically deployed to gather data about the physical world and its artifacts for a variety of purposes that range from environment monitoring, control, to data analysi...
Qi Han, Sharad Mehrotra, Nalini Venkatasubramanian