Abstract--To reduce chip-scale topography variation in Chemical Mechanical Polishing (CMP) process, dummy fill is widely used to improve the layout density uniformity. Previous res...
Chunyang Feng, Hai Zhou, Changhao Yan, Jun Tao, Xu...
A computer package is being developed at Bayreuth for the generation and investigation of discrete structures. The package is a C and C++ class library of powerful algorithms endow...
The StreamIt programming model has been proposed to exploit parallelism in streaming applications on general purpose multicore architectures. The StreamIt graphs describe task, da...
Abhishek Udupa, R. Govindarajan, Matthew J. Thazhu...
With the standardization of IEEE 802.11, there has been an explosive growth of wireless local area networks (WLAN). Recently, this cost effective technology is being developed aggr...
A parallel computing approach for large-scale SPICE-accurate circuit simulation is described that is based on a new preconditioned iterative solver. The preconditioner involves the...
Heidi Thornquist, Eric R. Keiter, Robert J. Hoekst...