24 search results - page 2 / 5 » A low-radix and low-diameter 3D interconnection network desi... |
HPCA
2009
IEEE
14 years 8 months ago
2009
IEEE
Interconnection plays an important role in performance and power of CMP designs using deep sub-micron technology. The network-on-chip (NoCs) has been proposed as a scalable and hi...
3DIC
2009
IEEE
14 years 2 months ago
2009
IEEE
- This paper describes a new architectural paradigm for fully connected, single-hop system level interconnection networks. The architecture is scalable enough to meet the needs of ...
SLIP
2009
ACM
14 years 1 months ago
2009
ACM
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
SLIP
2009
ACM
14 years 1 months ago
2009
ACM
New technologies such as 3D integration are becoming a new force that is keeping Moore’s law in effect in today’s nano era. By adding a third dimension in current 2D circuits...
CONEXT
2009
ACM
13 years 8 months ago
2009
ACM
Shipping-container-based data centers have been introduced as building blocks for constructing mega-data centers. However, it is a challenge on how to interconnect those container...