21 search results - page 2 / 5 » A novel framework for multilevel routing considering routabi... |
DAC
2006
ACM
14 years 8 months ago
2006
ACM
As the technology node advances into the nanometer era, via-open defects are one of the dominant failures. To improve via yield and reliability, redundant-via insertion is a highl...
TCAD
2008
13 years 7 months ago
2008
As the technology node advances into the nanometer era, via-open defects are one of the dominant failures due to the copper cladding process. To improve via yield and reliability, ...
SLIP
2003
ACM
14 years 10 days ago
2003
ACM
In this paper, we describe an accurate metric (perimeter-degree) for measuring interconnection complexity and effective use of it for controlling congestion in a multilevel framew...
DAC
2007
ACM
14 years 8 months ago
2007
ACM
Abstract-- In nanometer-scale VLSI technologies, several interconnect issues like routing congestion and interconnect delay have become the main concerns in placement. However, all...
ICCAD
2006
IEEE
14 years 4 months ago
2006
IEEE
In this paper, we propose the first wire density driven global routing that considers CMP variation and timing. To enable CMP awareness during global routing, we propose a compac...